S&C Micro provides microelectronics packaging and assembly services focused on die attach, flip chip attach, and wire bonding processes. The company supports rapid prototyping, pre-production design of experiments and characterization, and low to medium volume manufacturing for microelectronic devices. Its capabilities include epoxy and eutectic die attach, high-accuracy flip chip placement, ball-wedge and wedge-wedge wire bonding, ribbon bonding, stud bumping, and use of gold, aluminum, and copper-palladium wires. S&C Micro also offers encapsulation, plasma cleaning, wire pull and shear testing, and assembly process development. These services are intended for customers developing advanced microelectronic packages that require process definition, validation, and scalable assembly execution.
AVIQ has been providing Design and Build mounting solutions for various Digital Display needs.
Chengdu Galaxy Magnets Company Limited researches, designs, produces and sales bonded neodymium iron boron (Bonded NdFeB) magnets and per...
Established in 1984, JM Dixon Associates Ltd was set up by three ex Capper Neil Group design engineers with the purpose of providing desi...
The Filter Design Company, a leading provider of bespoke filtration solutions, was acquired in 2021 by Gentex Corporation, a global leade...
Anatec is an industrial company that specializes in the design and distribution of electronic components, development tools, and displays.
Averatek is a high tech company that provides custom design services and patterned circuit board materials.