S&C Micro

About

S&C Micro provides microelectronics packaging and assembly services focused on die attach, flip chip attach, and wire bonding processes. The company supports rapid prototyping, pre-production design of experiments and characterization, and low to medium volume manufacturing for microelectronic devices. Its capabilities include epoxy and eutectic die attach, high-accuracy flip chip placement, ball-wedge and wedge-wedge wire bonding, ribbon bonding, stud bumping, and use of gold, aluminum, and copper-palladium wires. S&C Micro also offers encapsulation, plasma cleaning, wire pull and shear testing, and assembly process development. These services are intended for customers developing advanced microelectronic packages that require process definition, validation, and scalable assembly execution.