Mirtec SPI specializes in 3D solder paste inspection systems designed for surface mount technology (SMT) and semiconductor manufacturing. Their systems utilize advanced optical technology to achieve high precision and repeatability, enabling the detection of minimal solder paste amounts for quality assurance. The SPI systems are equipped with features such as a Shadow-Free Dual Projection Moire Probe for accurate 3D measurements, bending and warping correction functions for inspecting warped PCBs, and a closed-loop system that communicates in real-time with other production equipment to optimize processes.
semiconductor manufacturing equipment, display manufacturing equipment
Lithography i‑line steppers, KrF/ArF steppers, ArF immersion scanners (NSR series) Alignment Litho Booster alignment systems Metrology / ...
LKing Plus automatic solder paste printing machine, Full Automatic Printer MXE PLUS, GDK solder paste printer TSE, Shenzhen GDK Fully Aut...
EcoWave, Centurion, Aquastorm 160
Wet Processing, Dry Processing, Deposition, CMP Remanufactured, DI Water Heater, Critical Point Dryer, Scribing, Grinding Dicing, Optical...
LCD Displays, TFT Displays, OLED Displays, LED Displays, AMOLED Displays, PMOLED Displays, ePaper Displays, FALD Displays, Micro LED Disp...