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About
Fujikoshi Machinery Corp specializes in the development, manufacturing, and sales of semiconductor and electronic material processing equipment and peripheral devices. They focus on precision cutting, grinding, and polishing processes, particularly for silicon wafers and other electronic materials. Their technologies include high-speed polishing techniques for SiC wafers and advanced adhesive processing for next-generation devices.
Products & Services
High-speed polishing technology for SiC wafersnext-generation device adhesive processing technologyfixed abrasive double-sided grinding lapingot automatic adhesive device (IMS)polishing pad surface property evaluation device (PSP-100)non-contact thickness measurement technology using infrared light
Quick Facts
- Location
- Nagano, Japan, Japan
- Category
- CNC & Machining
