Back to Directory
About
PacTech specializes in advanced packaging equipment and wafer-level packaging services for the semiconductor industry. They offer a range of products including advanced packaging machines designed for high volume production, laser soldering platforms, and various wafer-level packaging services such as electroless plating and electroplating. Their capabilities include solder bumping, metallization finishes, and the use of advanced technologies like X-ray and shear testing. PacTech serves multiple industries including automotive, aerospace, and telecommunications, with a focus on high precision and performance in their manufacturing processes.
Products & Services
SB² ® – SMs QuantumSB² ® - SMs QuantumSB² ® - WBSB² ® - USPLAPLACE ® – 3.5D ®SB² ® – CompactLAPLACE ® – LAB 300ASB² ® - SMSB² ® - JetLAPLACE ® – HTElectroless Plating ServiceElectroplating Service
Quick Facts
- Location
- Germany, Germany
- Category
- Electronics Manufacturing
