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About
NAMICS Europe GmbH specializes in advanced materials for semiconductor devices, offering products such as board level underfills, camera module adhesives, capillary underfills for wafer level packages, glob top and encapsulants, and liquid compression molded underfills. Their manufacturing capabilities include low temperature pressure-less sintering and pressure sintering technologies, which are essential for die attach applications. The company serves various industries including automotive, medical, aerospace, and consumer electronics, focusing on high-performance materials that meet stringent reliability requirements.
Products & Services
ADFLEMABoard Level Underfill (BLUF)Camera Module AdhesivesCapillary Underfill for Wafer Level Package (WLP)Glob Top & EncapsulantsLiquid Compression Molded Underfill (LCMUF)Low temperature pressure-less sinteringLow temperature Solder Glass PreformsPressure sintering
Certifications
ISO 9001IATF 16949ISO 14001
Quick Facts
- Location
- 85764 Oberschleißheim, Germany, Germany
- Category
- Electronics Manufacturing
