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About
SET Flip-Chip Bonders specialize in high-precision bonding processes for radio frequency (RF) applications, particularly in advanced satellite systems. They utilize thermocompression and leveling capabilities to achieve accurate alignment within 1 µm between chip and substrate. Their technology allows for the safe handling of brittle materials at elevated temperatures and high forces, improving bonding accuracy and performance in RF connections.
Products & Services
Image SensorsPixelized DetectorsFPA SensorsIR SensorsUV SensorsX-Ray SensorsOpto-electronicsSilicon PhotonicsµLEDs DisplaysLaser BarsOptical ComponentsPhotonics Packaging2.5D Integration3D IntegrationRF Applications
Quick Facts
- Location
- 74490 Saint-Jeoire, France, France
- Category
- Electronics Manufacturing
