SET Flip-Chip Bonders specialize in high-precision bonding processes for radio frequency (RF) applications, particularly in advanced satellite systems. They utilize thermocompression and leveling capabilities to achieve accurate alignment within 1 µm between chip and substrate. Their technology allows for the safe handling of brittle materials at elevated temperatures and high forces, improving bonding accuracy and performance in RF connections.
“French research institute for electronics and information technologies”
“Software company based in Wilsonville, Oregon”
“Company in Garching, Germany”
“Provider of microsystem engineering services”
“Multinational electronics and semiconductors manufacturer”
“Research and development organization”
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SiT7101, ENDR-TTT, SiT7201, SiT7202, SiT5543, SiT5541, SiT5349, SiT5348, SiT5347, SiT5346, SiT5147, SiT5146, SiT8945, SiT8944, SiT8921, S...
X-Ray Sources, Handheld Products, Benchtop Products, MOXI™ Small X-ray Sources, Moxtek end window X-ray tubes, Moxtek side window X-ray t...
Audio Products, Circuit Protection, Connectors, Discrete Semiconductors, Integrated Circuits (ICs), Sensors, Transducers, Power Supplies,...
Motor Control ICs, Stepper Motor Controller IC, Brushless DC Controller IC, DC Motor Controller IC, Ultrasonic Distance Sensor ICs, Senso...
Scanning Acoustic Microscopy, Sintering Solutions, Wafer Lamination Solutions, AOX/AOI Inspection Systems, Dual Column Upright Analytical...
TFT LCD modules, OLED display modules, E-Paper displays, monochrome LCD displays, bi-stable displays, character display modules, graphic ...