Tresky GmbH develops, produces, and distributes DIE bonders and large area sintering systems. Their technologies include active alignment for photonics systems, which utilize nanometer precision and modular processes. They serve industries such as semiconductor manufacturing and e-mobility, focusing on high power density and efficiency in power modules. Their systems are designed for both research and industrial manufacturing of optoelectronic assemblies, with capabilities for dispensing sinter paste for half-bridge modules and utilizing vibration technology for component feeding.
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