Boschman Technologies BV specializes in advanced packaging solutions, focusing on Ag-Sintering and Film Assisted Molding (FAM) technologies. They provide services in package development, assembly services, and production equipment for the electronic assembly industry. Their capabilities include low to medium volume assembly, prototyping, and high-volume production transfer. They utilize precision processes such as screen printing, wafer sawing, and automated optical inspection, serving industries like automotive, medical, avionics, mobile, and industrial renewables.
βFull packaging development supplierβ
βManufacturing company based in Gelderland Province, Netherlandsβ
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