Powatec GmbH specializes in the engineering and manufacturing of wafer singulation equipment, including manual and semi-automatic wafer mounters, UV curing systems, and back grinding tape laminators. Their products are designed for various wafer materials, including bare silicon, SOI wafers, and glass, with capabilities for wafer diameters ranging from 50mm to 300mm. They offer customized solutions for high precision dicing and mounting processes, ensuring air-void free application of tapes and accommodating different wafer thicknesses from 50µm to 4.5mm. Powatec also provides dicing services and a range of semiconductor consumables.
solid-state LiDAR
Kongsberg Discovery, Coda Octopus, Kongsberg Mesotech, FLEXVIEW 500kH multibeam sonar, Kongsberg Mesotech Ltd., SAAB Seaeye, Imenco, Digi...
A102H - Ø102mm incremental encoder, A19 - Ø19mm incremental encoder, A20 - Ø20mm incremental encoder, A28 - Ø28mm incremental encoder, A3...
Ultrasonic Distance sensor, Ultrasonic Level sensor, Obstacle Avoidance Sensor, Air Bubble detector, Industrial Ultrasonic Sensor, Water ...
electronic expansion valve (EXV-S), linear actuator (LA), compact actuator (FGA), blocking actuator (FBS), temperature compensation valve...
3D LiDar, Brackets & casing, Universal laser distance sensor, Brackets & reflectors, Interlock switch, Emergency switch, Infrared beam se...