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About
Powatec GmbH specializes in the engineering and manufacturing of wafer singulation equipment, including manual and semi-automatic wafer mounters, UV curing systems, and back grinding tape laminators. Their products are designed for various wafer materials, including bare silicon, SOI wafers, and glass, with capabilities for wafer diameters ranging from 50mm to 300mm. They offer customized solutions for high precision dicing and mounting processes, ensuring air-void free application of tapes and accommodating different wafer thicknesses from 50µm to 4.5mm. Powatec also provides dicing services and a range of semiconductor consumables.
Products & Services
Wafer MountersManual Wafer MounterSemi-Automatic Vacuum Wafer MounterSemi-Automatic Wafer MounterManual Non-Contact Wafer MounterBack Grinding Tape LaminatorUV Curing SystemWafer ExpanderDie-Matrix Expander6" and 8" Dicing Cassette300mm Dicing CassetteAuer Boats
Certifications
ISO 9001CE
Quick Facts
- Location
- 6331 Hünenberg, Switzerland, Switzerland
- Category
- Sensors & Measurement
