Kaijo Corporation manufactures ultrasonic cleaning systems and wire bonding machines, utilizing advanced ultrasonic technology for industrial applications. Their ultrasonic cleaning systems are designed for various industries, including semiconductors, electronics, precision parts, optics, mechanical, plating, automotive, and textile. They provide customized solutions, including turnkey systems and individual components, capable of cleaning intricate parts through microscopic cavitation bubbles. Their wire bonding machines are equipped with cutting-edge technology for high-speed and fine-pitch bonding in semiconductor manufacturing, supporting materials such as gold, silver, copper, and platinum.
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