LIDROTEC GmbH manufactures laser dicing technology specifically for wafer dicing in liquids. Their process utilizes controlled fluids to enhance cutting precision and quality, minimizing heat input to prevent microcracks and ensuring cleanliness by binding and rinsing particles. The technology is applicable across various industries including semiconductors, energy, medicine, electronics, and material science, allowing for the cutting of diverse materials such as SiC with minimal cutting widths and high aspect ratios, thus maximizing production yield.
2D LiDAR Sensors, 3D LiDAR Sensors, Automotive LiDAR Sensors, FMCW LiDAR Sensors, Flash LiDAR Sensors, Hesai FTX, Flash Lidar S240, Flash...
Optical Coating, Beamsplitters, Precision Mirrors, replicated toroidal mirrors, diffraction gratings
optical systems, photonic components, laser systems
Ruda Optical specializes in custom optical engineering and manufacturing services, providing solutions for optical and optomechanical pre...
Optotune Tunable Lenses, optical grade pucks, witness pieces, axicons
Line Scan Cameras, AdheScan, SK8k-U3DR4, SK4k-U3DR7C, SK4096MVHW, SK2048MVHW, SK1024U3HA, SK1024VJR-4, SK512U3SH, SK2048VSH-4L, SK2048MVS...