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About
LIDROTEC GmbH manufactures laser dicing technology specifically for wafer dicing in liquids. Their process utilizes controlled fluids to enhance cutting precision and quality, minimizing heat input to prevent microcracks and ensuring cleanliness by binding and rinsing particles. The technology is applicable across various industries including semiconductors, energy, medicine, electronics, and material science, allowing for the cutting of diverse materials such as SiC with minimal cutting widths and high aspect ratios, thus maximizing production yield.
Products & Services
LidroCUT®
Quick Facts
- Location
- 44805 Bochum, Germany, Germany
- Category
- Laser & 3D Measurement
