Finetech manufactures die bonding systems and SMD rework solutions, focusing on precision die attach technologies that are adaptable for both prototype and high-volume production. Their systems include production bonders that offer high yield and flexibility, R&D bonders that can be configured for various applications, and modular rework equipment designed for the complete SMD rework cycle. These systems are capable of handling a wide range of SMD components with high accuracy and control over process parameters.
Machine Vision For Autonomous Moving Robotic Arm, Low Powered Industrial Edge Computation, Janitor Robot, SensZ.AI, Outdoor Cleaning Arm
Aero, Hydro, Synchro, Talon, UR5e, UR10e, UR20, Push-Pull, Revo, Park’N’Arc, Rover, Dual-Fab, Heavy Duty Water Cooled, Standard Duty Air ...
bimanual robotics platform, tactile sensor prototype
PushCorp GrindXâ„¢, PushCorp SandXâ„¢, PushCorp FinishXâ„¢, Robotic Servo Spindles, Force Compliance Devices, Weld Removal Equipment, Robotic B...
modular end-effectors, AI-Driven Whole-Body Control robots
robot for precision handling, assembly and material handling, automated lifts, automated scales, robotic safes, factory conveyors