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ePAK International
Electronics Manufacturing
About
ePAK International specializes in the manufacturing of semiconductor handling solutions, including advanced wafer handling products such as eLX wafer canisters and wafer jars. They provide tailored solutions for silicon carbide (SiC) wafer handling, ensuring protection against surface defects and contamination. Their product offerings include Front Opening Shipping Boxes (FOSB) and Front Opening Unified Pods (FOUP) designed for the safe transport of 300mm semiconductor wafers. ePAK also manufactures precision-molded matrix trays, embossed carrier tapes, and IC shipping tubes, all produced with ESD-safe materials to protect sensitive devices throughout the supply chain. Their manufacturing capabilities include custom designs and a commitment to low particle generation and high cleanliness standards.
Products & Services
Silicon Carbide Wafer HandlingFOSB 300mm Wafer CarrierFOUP 300mm Wafer CarrierModular FOUP SystemMatrix TraysEmbossed Carrier TapeIC Shipping TubesWafer Interface MaterialseLXâ„¢ Zero-Movement CanistersePROâ„¢ Shipping BoxesProcess Boats and BoxesFlex Frames and ShippersHoop Rings and ShippersSingle Wafer ShipperseCT Standard Wafer Canisters
Certifications
ISO 9001ISO 14000IATF 16949ROHS Compliant
Quick Facts
- Location
- 78759 Austin, TX, USA, United States
- Founded
- 2006
- Category
- Electronics Manufacturing
