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Chipbond Technology Corporation
Electronics Manufacturing
About
Chipbond Technology Corporation specializes in packaging and testing services for integrated circuits (ICs). They utilize processes such as bumping, testing, and assembly, with specific capabilities in creating gold bumps and Cu/Ni/Au bumps using thin film, photolithography, and electroplating techniques. Their services include Back Side Metallization (BSM) for thermal conduction and impedance reduction, and they offer a range of wafer sizes and thicknesses, including 8-inch wafers with a minimum thickness of 75 micrometers. Chipbond also provides turnkey services that encompass various aspects of packaging and testing.
Products & Services
Bumping ServicesTest ServicesPackage ServicesBSM / FSM ServicesDPS ServicesCompound SemiconductorSiGe WaferGaAs WaferGaN WaferSiC WaferFlexible Tape-and-Reel Circuit Substrate (High-end FPC)Chip Tray
Quick Facts
- Location
- Hsinchu, Taiwan, Taiwan
- Founded
- 1997
- Category
- Electronics Manufacturing
