Chipbond Technology Corporation specializes in packaging and testing services for integrated circuits (ICs). They utilize processes such as bumping, testing, and assembly, with specific capabilities in creating gold bumps and Cu/Ni/Au bumps using thin film, photolithography, and electroplating techniques. Their services include Back Side Metallization (BSM) for thermal conduction and impedance reduction, and they offer a range of wafer sizes and thicknesses, including 8-inch wafers with a minimum thickness of 75 micrometers. Chipbond also provides turnkey services that encompass various aspects of packaging and testing.
FIPS 140-2 SSD Solutions, Industrial DRAM Modules, PCIe Gen4x4 M.2 2280 High Capacity Solution, 2TB High Capacity USB 3.2 drive, PCIe Gen...
European Market Partner Bv specializes in the distribution of tools and parts used in the semiconductor industry. They provide procuremen...
ColorWashTM, EDGE Series, WPX Series, GPX Series, DMX+ Series, VAC Series, RGB Vac Arch Light
Enplas Semiconductor Peripheral Corporation specializes in the development and supply of sockets and fixtures necessary for performance t...
Selling Ware Co Ltd specializes in the professional agency of semiconductor, optoelectronic, and panel-related materials and equipment. T...
Innores Co Ltd specializes in providing a variety of products for the semiconductor industry, utilizing advanced technology to meet the s...
βSchool in Aptos, Santa Cruz County, Californiaβ
βManufacturing company based in Taiwanβ
βAmerican semiconductor companyβ
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