SPM AG specializes in providing services and spare parts for the semiconductor industry, including bonding services and sputtering target materials. Their bonding service utilizes a unique technique developed in Japan that is material-independent and does not require metallization, ensuring stable quality. They also offer process control solutions with various monitoring systems to enhance wafer production and improve yield. Their product offerings include customized sputtering targets made from high-quality materials.
PipePatrol, Leak Detection, Theft Detection, Line Break Detection, Tightness Monitoring, Predictive Modeling, Stress Monitoring, Batch Tr...
AMC micro-pollution control solutions, modular filtration systems, activated carbon, modified activated carbon, ion exchange resins
Tsunami Automatic Water Separators, Tsunami Breathing Air Systems, Tsunami Standard Systems, Tsunami Dryer Systems, Tsunami Oil Coalescin...
pressure reducing valves, solenoid valves, water hammer arresters, pulse sensor water meters
Pumps, Blowers, Heat Exchangers, Valves, Instrumentation, IIoT, Steam, Hydronics, Municipal Products, Seal Pots, Control Panels, Process ...
Siemens PS2 Valve Positioner