Dynamic Process Group

About

Dynamic Process Group, Inc. is a company that specializes in wafer coring, offering a range of services and products for various industries. The company cores wafers, including silicon wafers, up to 450mm in diameter, into smaller wafers of standard sizes such as 25.4mm, 50.8mm, 76.2mm, 100mm, 150mm, 200mm, 300mm, and 450mm. Additionally, the company can cut patterned and blank wafers to any geometry or size, including round, square, notched, flat on the bottom, multiple flats, and more. The company's expertise extends to coring various materials, including silicon, germanium, gallium arsenide, indium phosphide, graphite, silicon carbide, diamond-coated wafers, stainless steel wafers, and many others. With their expertise in wafer coring, Dynamic Process Group, Inc. provides a valuable service to industries that rely on high-quality wafers.