APEX Research and Analysis is a company that specializes in designing and assembling innovative measurement systems. Their flagship product is a stand-alone system that measures both warpage and coefficient of thermal expansion (CTE) in wafer, IC chip, and board applications. This system utilizes digital image correlation (DIC) technology to accurately measure thermal warpage, deformation, strain, and CTE at high temperatures. With its headquarters in the USA and assembly facilities in Taiwan, APEX Research and Analysis offers a unique blend of American design expertise and Taiwanese manufacturing efficiency. By leveraging their expertise in thermal warpage and CTE measurement, the company provides valuable solutions to various industries.