Semiconductor Wafer

About

Custom Wafer Solutions specializes in customizing semiconductor wafers for device fabrication. The company guides customers through selecting material, doping type, size, thickness, and resistivity to match specifications. Surface preparation includes polishing and cleaning to ensure uniformity. Material deposition applies thin films via Chemical Vapor Deposition or Physical Vapor Deposition. Photolithography creates intricate patterns using photoresist and UV exposure. Etching removes unwanted material through wet or dry processes. Doping and implantation add impurities for electrical control. Metallization deposits copper or aluminum interconnects. Finally, testing and packaging evaluate functionality and dice wafers into individual chips for integration, delivering consistent quality for customers.