UniversityWafer

About

UniversityWafer offers comprehensive semiconductor processing services, including thin film deposition (thermal oxide, LPCVD nitride), metal sputtering (Al, Cu, Ti, Au, Pt), photolithography and patterning (photoresist coating, mask alignment, RIE/DRIE etching), back-end processing (wafer thinning, polishing, dicing, wafer bonding), and support for silicon, glass, III‑V materials. They act as a virtual fab for R&D and pilot production, providing fast turnaround for universities and fabs, bridging material supply and device manufacturing, offering custom processing steps from single steps to full device fabrication. Their capabilities include contact lithography, proximity alignment for ~1µm resolution, deep reactive ion etching for high aspect ratio structures, options.