LTRIN Co.

About

Our company is established in 2007 and doing wafer bonding equipment business and process development consulting as well as bonding foundry service in Korea. We provide all about Wafer Bonding Solutions & and field qualified equipment from R&D level to mass production. - Thermocompressive Bonder for MEMS, HB-LED and TSV. - Direct Bonder for SOI,BSI-CIS and Power Device. - Field Proven Technologies and Customer Oriented Service - Higher Throughput and Productivity