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Disco Hi-Tech America
Semiconductors
About
DISCO Hi-Tec America specializes in cutting, grinding, and polishing technology, providing precision processing for a variety of materials including silicon, sapphire, glass, ceramics, and bonded materials. The company offers services such as KKM Services for high precision processing of ICs, MEMS, and LEDs, as well as dicing, grinding, and polishing processes. Their capabilities include single cut, step cut, bevel cut, ultrasonic dicing, and wafer backgrind, with a focus on achieving excellent thickness tolerances and surface finishes.
Products & Services
Single CutStep CutBevel CutBlade GroovingCircle CutEdge TrimUltrasonic DicingWafer BackgrindChip and Partial Wafer GrindingPoligrindDry PolishCMP
Quick Facts
- Location
- Hillsboro, United States, United States
- Company Size
- 1-10
- Founded
- 2005
- Category
- Semiconductors
