KPN Technology

About

KPN Technology provides semiconductor wafer backend processing and packaging services for national security and commercial customers. The company offers wafer dicing for silicon, silicon carbide, gallium nitride, and other materials including partial and bumped wafers. It provides wafer backgrinding using automated equipment to achieve precise thickness targets in a cleanroom environment. KPN Technology also delivers wafer coring and chemical mechanical planarization to remove subsurface damage from backgrinding. Its services include wafer resizing, edge grinding, and polishing for freestanding and carrier-bonded wafers to support research and development and downstream manufacturing needs. KPN Technology focuses on secure wafer processing to support supply chain requirements for a range of semiconductor applications.