Growing industry requirement for vertical and heterogeneous integration remains a critical focus for many forward-looking semiconductor supply chain players. However, improving process yield and lowering the cost relative to alternatives are proving resilient bottlenecks to mainstream 2.5D and 3D packaging. Stay tuned for novel solutions developed by Vialessai Technologies to address these challenges.
Nanya Technology Corp. manufactures and markets dynamic random access memories (DRAMs). The Company sells its products in Taiwan and exp...
Founded by Industry veterans, XtremeSilica is composed of highly passionate dedicated team aiming to offer World class proven Silicon as ...
Printed circuit boards PCB substrate assembly, plug-ins, and processing
VISENGI is an engineering firm, built around an extensive knowledge & working experience on Hardware & Software development.
Interposers provides a basic technology for the manufacture of 3D semiconductor devices. Above all, the high demand for mobile electronic...
Scotech supply Capital Equipment and Consumables from market leading companies in the Vacuum Deposition and Etch field. Our product range...