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About
Growing industry requirement for vertical and heterogeneous integration remains a critical focus for many forward-looking semiconductor supply chain players. However, improving process yield and lowering the cost relative to alternatives are proving resilient bottlenecks to mainstream 2.5D and 3D packaging. Stay tuned for novel solutions developed by Vialessai Technologies to address these challenges.
Quick Facts
- Company Size
- 1-10
- Founded
- 2012
- Category
- Semiconductors
