III/V-Reclaim is a pioneering company in the recycling of semiconductor wafers and the optimization and development of CMP (Chemical Mechanical Planarization) technologies. With over 30 years of experience, we engineer innovative processes for a wide range of materials and nearly all wafer shapes. Our specialties include general reclaiming tailored to customer-specific demands, backside thinning on processed wafers, and high-precision polishing for Epi-Ready wafers, among many other services. Visit our website to learn more about our unique company and the services we offer: http://35reclaim.com.
Nanya Technology Corp. manufactures and markets dynamic random access memories (DRAMs). The Company sells its products in Taiwan and exp...
Founded by Industry veterans, XtremeSilica is composed of highly passionate dedicated team aiming to offer World class proven Silicon as ...
Printed circuit boards PCB substrate assembly, plug-ins, and processing
VISENGI is an engineering firm, built around an extensive knowledge & working experience on Hardware & Software development.
Interposers provides a basic technology for the manufacture of 3D semiconductor devices. Above all, the high demand for mobile electronic...
Scotech supply Capital Equipment and Consumables from market leading companies in the Vacuum Deposition and Etch field. Our product range...