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Sisco Interconnect
Semiconductors
About
Engineering, development and technical expertise ensure support of automated, system-level and development platforms for: ● Area array packages ● Peripheral packages ● Wafer-level ● Strip test ● The package on package (3D) test High-performance spring probe contact technologies continually drive down the cost of ownership Design Process ● Collaborated conversations and visits to understand customer requirements ● Conceptual designs / cost estimates ● Prototype/proof of concept ● Pre-production through production Follow Us on Facebook: https://www.facebook.com/siscointerconnect/
Quick Facts
- Location
- Singapore, Singapore, Singapore
- Company Size
- 11-50
- Category
- Semiconductors
