Okamoto Corporation specializes in the manufacturing of precision grinding and polishing tools, with a focus on applications in wafer manufacturing, including SOI, TSV, MEMS, and various hard materials. Their product range includes grinders, polishers, and lapping machines designed for materials such as Silicon, GaAs, Sapphire, Quartz, Silicon Nitride, InP, and SiC. Okamoto's tools are capable of processing wafers up to 300mm and are utilized in both front-end and back-end semiconductor processes.
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