OptoPAC provides CMOS Image Sensor (CIS) packaging and test services for compact camera modules used in mobile phone, notebook cameras and automotive applications. Patented NeoPAC technology enables thinner and more flexible packaging solutions to top-tier image sensor makers and camera module makers including SONY, Samsung LSI, SK Hynix, LGiT, Aptina, TI, and Melexis.
Nanya Technology Corp. manufactures and markets dynamic random access memories (DRAMs). The Company sells its products in Taiwan and exp...
Founded by Industry veterans, XtremeSilica is composed of highly passionate dedicated team aiming to offer World class proven Silicon as ...
Printed circuit boards PCB substrate assembly, plug-ins, and processing
VISENGI is an engineering firm, built around an extensive knowledge & working experience on Hardware & Software development.
Interposers provides a basic technology for the manufacture of 3D semiconductor devices. Above all, the high demand for mobile electronic...
Scotech supply Capital Equipment and Consumables from market leading companies in the Vacuum Deposition and Etch field. Our product range...