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Nanjing MicroBonding Semiconductor Co. — Supplier Profile | LeanSupplAI

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Nanjing MicroBonding Semiconductor Co.

Nanjing, People's Republic of China, People's Republic of Chinamicrobonding.cn201-1000Founded 2014

Semiconductors

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About

Nanjing MicroBonding Semiconductor Co.,Ltd was founded on 2014/8/8. It is focused on providing its customer with DIP,SOP,QFN,LGA and BGA packaging solutions, including wire bonding and flip chip, which the products are widely used in LED driver, DC/DC,AC/DC,LDO, Power Management,Touch IC, Blue Tooth, WiFi, GPS, MEMS Sensor(Gyroscope,Accelerator,G-sensor,Magnetic Sensor,Pressure Sensor, etc), ISP, RF PA and Fingerprint IC.The core value of the company is to provide customer service with professionalism, speed, and integrity.

Contact

info@microbonding.cn

+1 (555) 000-0000

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Quick Facts

Location: Nanjing, People's Republic of China, People's Republic of China
Company Size: 201-1000
Founded: 2014
Category: Semiconductors

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