Thin Film Interconnect designs and manufactures thin‑film interconnects, passive components, and custom substrate assemblies for microelectronics and RF systems. Offerings include thin‑film resistors, attenuators, and transmission lines patterned on ceramic, glass, and polymer substrates. Core processes cover sputter deposition, photolithography, laser trimming, plating, and precision dicing to produce wire‑bondable, solderable interconnect structures. Services span design support, prototyping, and scaled production, with electrical test and inspection for impedance and tolerance targets. Typical uses include microwave modules, sensor interfaces, and high‑density interposers in aerospace, industrial, and medical equipment.
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