NPOS Technologies

Pasadena, United States, United Statesnpos-usa.com1-10Founded 2002

Semiconductors

About

NPOS Technologies offers semi-auto wire bonder, deep access bond head, wedge application, ball application, stud bump application, ribbon application, thick-film photo imageable, fine line thick-film process, line resolution, and replacement of thin-film for the microelectronic and optoelectronic packaging industry. Their market segment is to bring novel solutions and support the assembly of semiconductor devices.

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Quick Facts

Location: Pasadena, United States, United States
Company Size: 1-10
Founded: 2002
Category: Semiconductors

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