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About
Wafer-level packaging solutions for MEMS and MOEMS WLP 4 OPTO developed a glass wafer processing technology that has been continually refined through ongoing studies on materials and processes research. Our semiconductor manufacturing process handles glass and silicon wafers, delivering a wafer-level packaging solution for 6 and 8-inch wafers with 400 to 700 opto-packages per wafer. The optimal combination of technology, product, and market experts, together with our IP backed process, positions us to capitalize on a unique market opportunity.
Quick Facts
- Location
- Munich, Germany, Germany
- Company Size
- 1-10
- Founded
- 2022
- Category
- Semiconductors
