Advanced Packaging Center BV provides IC/device packaging, qualification, and testing services for the semiconductor and sensor industries. It offers research, development, qualification, prototyping, and small to medium volume manufacturing services for MEMS, sensors, and IC packaging. The company’s package development services include research and design of package concepts; feasibility study on package concepts; investigation on package assembly risks and targeted costs; and package road map support services. It also offers assembly services, such as prototyping and small series volume manufacturing services; Q&R failure analysis test services; and transfer to mass production services, in...
Nanya Technology Corp. manufactures and markets dynamic random access memories (DRAMs). The Company sells its products in Taiwan and exp...
Founded by Industry veterans, XtremeSilica is composed of highly passionate dedicated team aiming to offer World class proven Silicon as ...
Printed circuit boards PCB substrate assembly, plug-ins, and processing
VISENGI is an engineering firm, built around an extensive knowledge & working experience on Hardware & Software development.
Interposers provides a basic technology for the manufacture of 3D semiconductor devices. Above all, the high demand for mobile electronic...
Scotech supply Capital Equipment and Consumables from market leading companies in the Vacuum Deposition and Etch field. Our product range...