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Jiangsu Wintime Semiconductor Co.
Semiconductors
About
Jiangsu Wintime Semiconductor Co. specializes in wafer-level high-precision cutting consumables and solutions for the semiconductor and advanced materials industries. The company develops and manufactures electroformed diamond dicing blades, metal and resin blades, grindstones, grinding wheels, glass powders, and UV adhesive tapes used in wafer, substrate, glass, ceramic, alloy, LED, MEMS, and packaging cutting. Its tools support applications such as wafer sawing, package singulation, and precision grooving across integrated circuits, optical communication, and new functional materials. Jiangsu Wintime Semiconductor Co. also offers process-focused cutting plans that match blade types, tapes, and parameters to customer materials and lines.
Quick Facts
- Location
- Rugao, People's Republic of China, People's Republic of China
- Company Size
- 51-200
- Founded
- 2020
- Category
- Semiconductors
