Veevx creates products that help with bringing the data center-level AI compute performance to mobile and edge devices. Our high-performance, ultra-low power compute engines enable customers to run complex models on-device, which are typically processed in the cloud, resulting in an enhanced user experience. Veevx designs and delivers the following: memory & accelerator semiconductors that ASIC companies' co-package and sell into mobile and edge devices. We specialize in new memory technology and mixed signal compute. Our iRAM-based CIM accelerator delivers approximately 10 times the performance efficiency (TOPs/W) compared to existing digital SRAM-based implementations. Veevx Intelligent Memory (iRAM) Chiplets combine high performance, high density, and ultra-low power enabling the next generation in memory technology to service the demands from a wide variety of markets. iRAM performance and non-volatility enables replacement of large block SRAM with 100X reduction in deep sleep power and 2X improvement in density. The Veevx Intelligent Memory product family spans memory densities from 2MB to 128MB and supports 3D and 2.5D packaging options with a configurable Chiplets interface. We are working on High-performance/Ultra-low power compute by integrating mixed signal compute directly into the memory architecture. We take ultra-low power MRAM and add innovations to increase the performance of the memory cells while adding innovative mixed signal compute to our silicon verified ultra-low power MRAM to maximize the compute in memory performance and energy efficiency. Our solution mitigates the power and latency by avoiding data movement to the processor. Our mixed signal compute is flexible to perform the mathematical operations used in AI using 1/100 the power of traditional digital compute engines. We want to keep our accelerator flexible so as models continue to evolve, we will be able to run the operations on our accelerator.
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