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About
We develop hardware solutions that offer best-in-class performance, size and weight by combining scalable manufacturing and cutting-edge design techniques. Our groundbreaking system-in-package (SiP) technology merges ultra-low loss, pinpoint precision, and featherlight design into one powerhouse solution. This innovation enables us to engineer RF systems that deliver an unmatched combination of compactness, lightness, and high performance – redefining the future of wireless technology and outperforming conventional SoCs.
Quick Facts
- Location
- Stockholm, Sweden, Sweden
- Company Size
- 11-50
- Founded
- 2020
- Category
- Semiconductors
