Advanced International Technology

About

Advanced International Technology provides wafer processing, dicing, micro-assembly, and fabrication services for semiconductor and microelectronic applications. The company performs dicing on a wide range of substrate materials including silicon, fused silica, glass, sapphire, ceramics, and PCB and PZT materials. It offers micro-assembly services such as die attach, wire bonding, and encapsulation using various epoxies and bonding techniques including wedge bonding, ball bonding, and die bonding. Its team handles small to medium batch processing and supports unusual bonding configurations and temperature constraints. Advanced International Technology serves applications in data storage, biotechnology, MEMS, and nanotechnology that require precision machining and engineering. The company works with bondable substrates such as platinum, gold, and aluminum and can accommodate additional materials with special treatment.