Back to Directory
3DiS Technologies
Semiconductors
About
3DiS Technologies develops 3D integration and 3D packaging solutions for electronic systems. The company focuses on 3D interconnect, 3D redistribution layer, and wafer-level 3D system-in-package technologies that enable miniaturized, high-performance RF and mixed-signal modules. It also designs and supplies 3D integrated passive devices such as filters, couplers, baluns, inductors, and transformers. 3DiS provides design, simulation, development, prototyping, small-volume production, and technology licensing services to customers in consumer, medical, defense, and space electronics.
Quick Facts
- Location
- Labège, France, France
- Company Size
- 1-10
- Founded
- 2014
- Category
- Semiconductors
