Icemos Technology Ltd. provides thick film bonded SOI (silicon on insulator) wafers. It offers bonded SOI wafers, Si-Si bonded wafers, customized engineered substrate solutions, and wafer interconnect technology. The company also provides foundry services, such as IC processing services and MEMS or MST (microsystems technology) processing services. Its products are used in various applications, such as telecommunications products and optical devices; dielectrically isolated integrated circuits; solid state relays; and micromachined components for sensors and actuators. The company serves telecommunications, automotive, entertainment, medical, and instrumentation sectors. Icemos Technology Ltd. was incorporated in 2003 and is based in Belfast, United Kingdom.
Nanya Technology Corp. manufactures and markets dynamic random access memories (DRAMs). The Company sells its products in Taiwan and exp...
Founded by Industry veterans, XtremeSilica is composed of highly passionate dedicated team aiming to offer World class proven Silicon as ...
Printed circuit boards PCB substrate assembly, plug-ins, and processing
VISENGI is an engineering firm, built around an extensive knowledge & working experience on Hardware & Software development.
Interposers provides a basic technology for the manufacture of 3D semiconductor devices. Above all, the high demand for mobile electronic...
Scotech supply Capital Equipment and Consumables from market leading companies in the Vacuum Deposition and Etch field. Our product range...