ChipMOS Technologies Inc.

About

ChipMOS Technologies Inc. specializes in semiconductor packaging and testing services. They offer a variety of IC packaging technologies, including leadframe-based packages such as small outline package (SOP), thin small outline package (TSOP), and quad flat package (LQFP/TQFP), as well as substrate-based packages like FBGA, VFBGA, stacked CSP, TFBGA, LGA, COG, and COF. Their capabilities include wafer bumping technologies such as gold bumping, metal composite bumping (MCB), and copper pillar bumping, aimed at providing solutions for LCD driver ICs and other applications requiring high-density connections. They also provide testing solutions for a wide range of integrated circuits, including digital logic, ASIC, high-speed digital, memory, mixed signal, and display driver IC devices.

Certifications