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About
nepes corporation specializes in semiconductor packaging solutions, including advanced technologies such as Wafer Level Package (WLP), Fan-Out Wafer Level Package (FOWLP), and Flip Chip Bumping. The company provides services in bumping, testing, and packaging for various applications, particularly in the semiconductor and display industries. nepes has developed capabilities for high-performance packaging, including the production of 600mm Fan-Out PLP and advanced semiconductor materials.
Products & Services
Wafer Level PackageFan-Out Wafer Level PackageFlip Chip BumpingBumpingTesting Services
Certifications
ISO 9001ISO 14001ISO 45001IATF 16949ANSI/ESD S20.20-2021SONY Green PartnerAEO
Quick Facts
- Location
- Eumseong, South Korea, South Korea
- Category
- Electronics Manufacturing
