Back to Directory
Boschman Advanced Packaging Technology
Netherlands, Netherlandsboschmanadvancedpackagingtechnology.recruitee.com
Electronics Manufacturing
About
Boschman Advanced Packaging Technology specializes in advanced back-end semiconductor packaging solutions, focusing on Pressure Sintering and Transfer Molding technologies. They provide services that include package development, assembly services, and equipment for semiconductor manufacturing. Their expertise covers the co-development of semiconductor packages, small to medium volume micro assembly, and the provision of pressure sintering and transfer molding equipment. The company serves industries such as Power Electronics, MEMS, and Sensors, particularly in the context of the Global Energy Transformation and Electric Revolution.
Products & Services
Pressure SinteringTransfer MoldingPackage Development ServicesAssembly & Test ServicesIndustrial Equipment
Quick Facts
- Location
- Netherlands, Netherlands
- Category
- Electronics Manufacturing
