Boschman Advanced Packaging Technology specializes in advanced back-end semiconductor packaging solutions, focusing on Pressure Sintering and Transfer Molding technologies. They provide services that include package development, assembly services, and equipment for semiconductor manufacturing. Their expertise covers the co-development of semiconductor packages, small to medium volume micro assembly, and the provision of pressure sintering and transfer molding equipment. The company serves industries such as Power Electronics, MEMS, and Sensors, particularly in the context of the Global Energy Transformation and Electric Revolution.
FIPS 140-2 SSD Solutions, Industrial DRAM Modules, PCIe Gen4x4 M.2 2280 High Capacity Solution, 2TB High Capacity USB 3.2 drive, PCIe Gen...
European Market Partner Bv specializes in the distribution of tools and parts used in the semiconductor industry. They provide procuremen...
ColorWashTM, EDGE Series, WPX Series, GPX Series, DMX+ Series, VAC Series, RGB Vac Arch Light
Enplas Semiconductor Peripheral Corporation specializes in the development and supply of sockets and fixtures necessary for performance t...
Selling Ware Co Ltd specializes in the professional agency of semiconductor, optoelectronic, and panel-related materials and equipment. T...
Innores Co Ltd specializes in providing a variety of products for the semiconductor industry, utilizing advanced technology to meet the s...