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About
HiSOL, Inc. specializes in providing probing solutions for measurement applications, as well as manufacturing equipment for wafer bonding, laser processing, and analysis. Their product offerings include various types of bonders, probers, and laser processing equipment, catering to research and development needs in the semiconductor industry.
Products & Services
BonderWire BonderManual Wedge BonderMulti-Wire Bonder (Ball & Wedge Compatible Type) MODEL-7KFMulti-Wire Bonder (Ball & Wedge Compatible Type) MODEL-7KEManual Wedge Bonder E SeriesManual Deep Access Wedge Bonder MODEL-7476D (7600D Specification)Manual Wedge Wire Bonder MODEL-7476D (7400D Specification)Semi-Automatic Wire BonderSemi-Automatic Multi-Wire Bonder (Ball & Wedge Compatible Type) MODEL-4KESemi-Automatic Multi-Wedge Wire Bonder MODEL-4546EManual Ball & Bump BonderEpoxy Die Bonder MODEL-7200CRManual Eutectic Die Bonder (6 Types Collet Type) MODEL-7327CEutectic Die Bonder (Single Collet) MODEL-7316C
Certifications
Health Management Excellent Corporation 2020
Quick Facts
- Location
- Japan
- Category
- Test & Measurement
