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About
Daeduck Electronics specializes in semiconductor packaging solutions, including advanced technologies for Flip Chip Ball Grid Array (FCBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), System In Package (SiP), Antenna In Package (AiP), and Flip Chip Board On Chip (FCBOC). The company employs high-layer build-up methods, ultra-fine circuit formation, and advanced materials to produce high-performance substrates for applications in CPUs, ASICs, mobile devices, and high-speed communication systems.
Products & Services
FCBGAFCCSPCSPSiPAiPFCBOC
Quick Facts
- Location
- Korea
- Category
- Electronics Manufacturing
