Back to Directory
About
Kinsus Interconnect Technology Corp. specializes in the manufacturing of advanced semiconductor packaging solutions. The company produces a variety of substrates including System In Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). These products are designed for high-performance applications in consumer electronics, particularly in smartphones and wearable devices, utilizing materials such as glass fiber immersed resin copper clad laminate.
Products & Services
SiPPBGAFCCSPCSPRF modulesFCBGA
Quick Facts
- Location
- Taoyuan City, Taiwan, Taiwan
- Category
- Electronics Manufacturing
