Kinsus Interconnect Technology Corp. specializes in the manufacturing of advanced semiconductor packaging solutions. The company produces a variety of substrates including System In Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). These products are designed for high-performance applications in consumer electronics, particularly in smartphones and wearable devices, utilizing materials such as glass fiber immersed resin copper clad laminate.
FIPS 140-2 SSD Solutions, Industrial DRAM Modules, PCIe Gen4x4 M.2 2280 High Capacity Solution, 2TB High Capacity USB 3.2 drive, PCIe Gen...
European Market Partner Bv specializes in the distribution of tools and parts used in the semiconductor industry. They provide procuremen...
ColorWashTM, EDGE Series, WPX Series, GPX Series, DMX+ Series, VAC Series, RGB Vac Arch Light
Enplas Semiconductor Peripheral Corporation specializes in the development and supply of sockets and fixtures necessary for performance t...
Selling Ware Co Ltd specializes in the professional agency of semiconductor, optoelectronic, and panel-related materials and equipment. T...
Innores Co Ltd specializes in providing a variety of products for the semiconductor industry, utilizing advanced technology to meet the s...
βAmerican multinational semiconductor companyβ
βUniMicron Technology Corporationβ
βAmerican multinational technology companyβ
βUniMicron Technology Corporationβ
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