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About
ZEN VOCE CORPORATION specializes in the manufacturing of semiconductor packaging test equipment and fixtures. Established in April 1999, the company has developed and manufactured semiconductor memory test fixtures and expanded its offerings to include semi-automatic single spindle cutting machines for semiconductor wafers/LEDs and fully automatic dual spindle cutting machines for 12" wafers. They also produce large substrate BGA (Ball Grid Array) ball placement machines and dual spindle fully automatic singulation saws. In addition to in-house developed equipment, they act as agents for semiconductor pre-burn test connectors, MEMS equipment, solar equipment, and LCD testing equipment, providing comprehensive technical services to meet customer expectations and needs.
Products & Services
IC packaging ball placement machinewafer cutting machinecleaning machinesubstrate cutting machinewafer test probe card PCBIC test HIFIXCHANG KITIC backend test Load BoardSOCKETIC pre-burn test SOCKET
Quick Facts
- Location
- Hsinchu, Taiwan, Taiwan
- Category
- Test & Measurement
