American Dicing, Inc. specializes in precision wafer dicing, die sorting, and packaging services, including die mounting and wire bonding. They offer high precision dicing and scribing of silicon wafers and other materials such as glass, sapphire, quartz, graphene, and ceramic. Their capabilities include handling wafers up to 12 inches in size, with die sizes as small as 0.295 mm. They provide automated die sorting with visual inspection and custom labeling, as well as die bonding and wire bonding services using gold, aluminum, and copper wires.
Tsang Yow Industrial Co Ltd specializes in manufacturing transmission system components and assemblies. They serve world-renowned compani...
MAKINO ASIA PTE LTD specializes in high precision machining and the development of machining technologies. The company focuses on providi...
DERIGHT PRECISION MACHINERY CO., LTD. specializes in the manufacturing of powder processing equipment. The company focuses on creating hi...
Lightweight Steel Profile Production Line, 12 Station CNC Rollform (HC-RF-90/140), 12 Station Rollform, Profile Production Line, Servo Fl...
CNC precision engineering, filter fan units (FFU), electrical assemblies, mechanical assemblies, pneumatic assemblies, hydraulic assembli...
CNC milling, CNC turning