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About
American Dicing, Inc. specializes in precision wafer dicing, die sorting, and packaging services, including die mounting and wire bonding. They offer high precision dicing and scribing of silicon wafers and other materials such as glass, sapphire, quartz, graphene, and ceramic. Their capabilities include handling wafers up to 12 inches in size, with die sizes as small as 0.295 mm. They provide automated die sorting with visual inspection and custom labeling, as well as die bonding and wire bonding services using gold, aluminum, and copper wires.
Products & Services
Wafer DicingDie SortingDie BondingWire BondingGel-PaksWaffle PacksJedec TraysTape and ReelGrip-Ring Hoops
Quick Facts
- Location
- Liverpool, New York, United States
- Category
- CNC & Machining
