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About
Die Bond specializes in the Liquid Interface Diffusion (LID) bonding process for joining split-layer injection molding dies that contain complex conformal cooling passages. This process enhances production speed and reduces die fabrication costs. Die Bond's capabilities include hermetically joining die designs, minimizing braze alloy issues, achieving high bond strength and ductility, and improving bonding yield compared to conventional methods. Their technology is particularly beneficial for moldmakers requiring conformal cooling, as it eliminates the need for water line plugs and reduces warpage during cooling.
Products & Services
Liquid Interface Diffusion (LID) bonding process
Quick Facts
- Location
- United States
- Category
- Welding & Joining
