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About
TSMC specializes in 3D silicon stacking and advanced packaging technologies. The company offers solutions such as TSMC-SoIC® (System on Integrated Chips), CoWoS® (Chip on Wafer on Substrate), and InFO (Integrated Fan-Out) to enable both homogeneous and heterogeneous chip integration. These technologies are designed to meet customer requirements for high performance, high compute density, energy efficiency, low latency, and high integration, serving industries such as cloud computing, artificial intelligence, and mobile computing.
Products & Services
TSMC-SoIC®CoWoS®InFO
Quick Facts
- Location
- Hsinchu, Taiwan, Taiwan
- Category
- Electronics Manufacturing
