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About
ASMPT SEMI Solutions specializes in manufacturing and marketing a broad line of assembly and packaging equipment for the microelectronics, semiconductor, photonics, and optoelectronics industries. Their offerings include die bonding, molding, and integration into complete in-line systems, with a focus on ultra-high precision die attach equipment and advanced packaging deposition equipment. They serve markets such as opto, silicon photonics, automotive sensors, and more.
Products & Services
AB339Eagle 60 wire bonderTCB Bonder
Quick Facts
- Location
- Germany
- Category
- Electronics Manufacturing
